On-chip miniature X-ray source and manufacturing method therefor
AssigneePeking University
InventorXianlong Wei
Life of this patent
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Abstract
Provided are an on-chip miniature X-ray source and a method for manufacturing the same. The on-chip miniature X-ray source includes: an on-chip miniature electron source; a first insulating spacer provided on an electron-emitting side of the on-chip miniature electron source, where the first insulating spacer has a cavity structure; and an anode provided on the first insulating spacer, where a closed vacuum cavity is formed between the on-chip miniature electron source and the anode. The on-chip miniature X-ray source has the advantages of stable X-ray dose, low working requirements for vacuum, fast switch response, capability of integration and batch fabrication, and can be used in various types of small and portable X-ray detection, analysis and treatment devices.
Claims15
An on-chip miniature X-ray source, comprising:
- an on-chip miniature electron source;
- a first insulating spacer provided on an electron-emitting side of the on-chip miniature electron source, wherein the first insulating spacer has a cavity structure;
- and
- an anode provided on the first insulating spacer,
- wherein a closed vacuum cavity is formed between the on-chip miniature electron source and the anode,
- wherein the on-chip miniature electron source comprises:
- a substrate;
- a resistive-switching material film layer covering a surface of the substrate;
- and
- at least one electrode pair provided on the resistive-switching material film layer, wherein the at least one electrode pair comprises a first electrode and a second electrode, and there is a gap between the first electrode and the second electrode,
- wherein a tunnel junction is formed within a region of the resistive-switching material film layer under the gap,
- wherein the substrate is made of a material with thermal conductivity,
- the resistive-switching material film layer is provided with at least one through hole connecting with the substrate, and
- at least one electrode of the at least one electrode pair is in contact with and connected to the substrate via the at least one through hole.
A method for manufacturing an on-chip miniature X-ray source, comprising:
- preparing an on-chip miniature electron source;
- preparing an anode, wherein a first insulating spacer is provided on a surface of the anode, and the first insulating spacer has a cavity structure;
- and
- bonding the first insulating spacer to an electron-emitting side of the on-chip miniature electron source, so that a closed vacuum cavity is formed between the on-chip miniature electron source and the anode,
- wherein the preparing an on-chip miniature electron source comprises:
- providing a substrate;
- forming a resistive-switching material film layer covering a surface of the substrate;
- forming at least one electrode pair on the resistive-switching material film layer, wherein the at least one electrode pair comprises a first electrode and a second electrode, and there is a gap between the first electrode and the second electrode;
- and
- before or after the bonding the first insulating spacer to an electron-emitting side of the on-chip miniature electron source, so that a closed vacuum cavity is formed between the on-chip miniature electron source and the anode, the preparing the on-chip miniature electron source further comprises:
- controlling the resistive-switching material film layer under the gap to be softly broken down and exhibit a resistive-switching characteristic, so as to form a tunnel junction within a region of the resistive-switching material film layer under the gap,
- wherein the substrate has thermal conductivity, and after the forming a resistive-switching material film layer and before the forming at least one electrode pair, the method further comprises:
- forming at least one through hole connecting with the substrate on the resistive-switching material film layer,
- wherein at least one electrode of the at least one electrode pair is in contact with and connected to the substrate via the at least one through hole.
Dependencies are inferred from the claim text.