US 11,794,305 B2 · Platen surface modification and high-performance pad conditioning to improve CMP performance

Abstract

Embodiments herein generally relate to chemical mechanical polishing (CMP) systems and methods for reducing non-uniform material removal rate at or near the peripheral edge of a substrate when compared to radially inward regions therefrom. In one embodiment, a polishing system includes a substrate carrier comprising an annular retaining ring which is used to surround a to-be-processed substrate during a polishing process and a polishing platen. The polishing platen includes cylindrical metal body having a pad-mounting surface. The pad-mounting surface comprises a plurality of polishing zones which include a first zone having a circular or annular shape, a second zone circumscribing the first zone, and a third zone circumscribing the second zone. A surface of the second zone is recessed from surfaces of the first and third zones adjacent thereto, and a width of the second zone is less than an outer diameter of the annular retaining ring.

Claims17

Dependent claims

A polishing system, comprising:

a substrate carrier comprising an annular retaining ring configured to surround a to-be-processed substrate during a polishing process;
and
a rotatable polishing platen comprising a cylindrical metal body having a pad-mounting surface, wherein
the pad-mounting surface comprises a plurality of polishing zones which include a first zone having a circular or annular shape, a second zone circumscribing the first zone, and a third zone circumscribing the second zone,
at least portions of the pad-mounting surface in the first and third zones define a plane,
the plane is orthogonal to a rotational axis of the polishing platen,
the pad-mounting surface in the second zone is recessed from the plane,
a width of the second zone is less than an outer diameter of the annular retaining ring, and
the pad-mounting surface in the third zone slopes upwardly from the pad-mounting surface in the second zone to intersect a circumferential edge of the platen at an acute angle.

6 more elements

A method of polishing a substrate, comprising:

urging, using a substrate carrier, a substrate against a surface of a polishing pad, the polishing pad disposed on a pad-mounting surface of a polishing platen, wherein
the pad-mounting surface comprises a plurality of polishing zones which include a first zone having a circular or annular shape, a second zone circumscribing the first zone, and a third zone circumscribing the second zone,
at least portions of the pad-mounting surface of the first and third zones define a plane,
the pad-mounting surface in the third zone slopes upwardly from the pad-mounting surface in the second zone to intersect a circumferential edge of the platen at an acute angle,
the plane is orthogonal to a rotational axis of the polishing platen, and
the pad-mounting surface in the second zone is recessed from the plane.

3 more elements

Dependencies are inferred from the claim text.

Platen surface modification and high-performance pad conditioning to improve CMP performance

Life of this patent

Platen surface modification and high-performance pad conditioning to improve CMP performance

Life of this patent

Abstract

Claims17