Printed circuit board and display connection structure
AssigneesChongqing Advance Display Technology Research, Chongqing Hkc Optoelectronics Technology Co., Ltd.
InventorXiaoyu Huang
Life of this patent
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Abstract
This application relates to a printed circuit board, including: a plurality of bonding pad areas configured to be electrically connected to a display; a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground; and a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area. The contact pad area includes a plurality of contact pads configured to be electrically connected to an external input connector. A width of the plurality of contact pads is 0.3 mm, and a distance between the plurality of contact pads is 0.2 mm. A length of the contact pad is the same as a length of a bonding pad in the bonding pad area.
Claims20
A printed circuit board, comprising:
- a plurality of bonding pad areas configured to be electrically connected to a display;
- a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground;
- and
- a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area.
A display connection structure, comprising:
- a display area comprising a fanout area;
- a printed circuit board (PCB) configured to be electrically connected to the fanout area and comprising:
- a plurality of bonding pad areas configured to be electrically connected to the fanout area;
- and
- a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground;
- and
- a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area.
A display connection structure, comprising:
- a display area comprising a fanout area;
- a printed circuit board (PCB) configured to be electrically connected to the fanout area and comprising:
- a plurality of bonding pad areas configured to be electrically connected to the fanout area;
- and
- a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground;
- and
- a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area, wherein
- the fanout area comprises a turn-on voltage and a turn-off voltage electrically connected to a first switch and a second switch, to control turn-on or turn-off of the first switch and the second switch;
- the first switch and the second switch are electrically connected to the bonding pad area of the PCB, and a resistance exists between the turn-on voltage and the turn-off voltage, the resistance being greater than 100 KΩ;
- and
- the fanout area comprises a first Schottky diode electrically connected between the first switch and the ground and a second Schottky diode electrically connected between the second switch and the ground.
Dependencies are inferred from the claim text.