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US 11,791,302 B2Granted
Thermosetting sheet, dicing die bonding film, and semiconductor apparatus
AssigneeNitto Denko Corporation
InventorsRena Kojima, Tomoaki Ichikawa
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Abstract
Provided in the present invention is a thermosetting sheet including a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. The thermosetting sheet has an arithmetic average roughness Ra of 0.1 μm or more and 1.2 μm or less that is measured in a state before being cured.
Claims5
A thermosetting sheet comprising:
- a thermosetting resin;
- a thermoplastic resin;
- a volatile component;
- and
- conductive particles,
- the thermosetting sheet having an arithmetic average roughness Ra of 0.1 μm or more and 1.2 μm or less that is measured in a state before being cured,
- the thermosetting sheet having a maximum height roughness Rz of 1 μm or more and 12 μm or less that is measured in the state before being cured.
4 more elements
Dependencies are inferred from the claim text.