Systems and methods for joining a first structure and a second structure with a choreographed adhesive de-aeration process

A method of joining a first structure and a second structure, the method comprising:

• placing an adhesive within a bond cavity for bonding a first structure to a second structure;
• inserting a collapsible standoff into a bottom area of the bond cavity to control a distance of distribution of the adhesive into the bond cavity based on temperature, wherein the collapsible standoff collapses at a predetermined temperature;
• securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure;
• evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity;
• after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure;
• and
• curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.

A method of joining a first structure and a second structure, the method comprising:

• placing an adhesive within a bond cavity for bonding a first structure to a second structure;
• placing a collapsible standoff in a hole of a surface of the second structure, wherein the surface of the second structure is configured to move toward the first structure, wherein the adhesive is placed in the hole of the surface of the second structure;
• securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure;
• evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity;
• after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure and the first structure is forced against the collapsible standoff to contact the collapsible standoff and force the adhesive to flow between the first structure and the second structure;
• and
• curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.