Bonding system and bonding method
AssigneesToyota Customizing & Development Co., Ltd., Aisin Seiki Kabushiki Kaisha, Toyota Jidosha Kabushiki Kaisha, National University Corporation Nagoya University, Toray Industries, Inc., Teijin Limited, Komatsu Ltd., Subaru Corporation
InventorsKenji Furuyashiki, Hiroshi Yuchi, Satoshi Hirawaki, Yoshinori Yamamori, Takayuki Mori, Yoshihiro Iwano, Kazuaki Amaoka
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Abstract
A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.
Claims14
A bonding system comprising:
- a supporting jig having a mounting surface including a plurality of bonding supporting surfaces on which bonding substrates are mounted, wherein at least two of the bonding supporting surfaces have different normal directions angled relative to each other at 90 degrees or less;
- a stand configured to support a portion of the supporting jig;
- a turning bearing disposed between the stand and the supporting jig;
- a spring-loaded ball roller disposed between the stand and the supporting jig, the spring-loaded ball roller spaced a distance from the turning bearing;
- a bonding device that sandwiches and welds the bonding substrates between the bonding device and the mounting surface;
- an articulated robot to which the bonding device is attached, the articulated robot configured to move the bonding device;
- a temperature adjustment device that adjusts a temperature of the mounting surface;
- and
- a control unit configured to control the articulated robot and the bonding device to move the bonding device to the plurality of bonding supporting surfaces and weld the bonding substrates thereon.
A bonding method comprising:
- welding bonding substrates, which include a thermoplastic resin material, using a bonding system, the bonding system comprising:
- a supporting jig having a mounting surface including a plurality of bonding supporting surfaces on which the bonding substrates are mounted, wherein at least two of the bonding supporting surfaces have different normal directions angled relative to each other at 90 degrees or less;
- a stand configured to support a portion of the supporting jig;
- a turning bearing disposed between the stand and the supporting jig;
- a spring-loaded ball roller disposed between the stand and the supporting jig, the spring-loaded ball roller spaced a distance from the turning bearing;
- a bonding device that sandwiches and welds the bonding substrates between the bonding device and the mounting surface;
- an articulated robot to which the bonding device is attached, the articulated robot configured to move the bonding device;
- a temperature adjustment device that adjusts a temperature of the mounting surface;
- and
- a control unit configured to control the articulated robot and the bonding device to move the bonding device to the plurality of bonding supporting surfaces and weld the bonding substrates thereon.
Dependencies are inferred from the claim text.