Die layout calculation method, apparatus, medium, and device

A die layout calculation apparatus, comprising:

• a first movement module, configured to:
• select, based on a distribution array of a plurality of dies in a wafer, one die as a reference die;
• and
• make, based on a first step and the distribution array of the plurality dies, a plurality of first movements of a wafer center in a preset region of the reference die to determine a first coverage region of the wafer for each first movement, and determine a feasible region of the reference die based on a number of complete dies in the plurality of dies in each first coverage region;
• a second movement module, configured to:
• make, based on a second step, a plurality of second movements of the wafer center in the feasible region to determine a second coverage region of the wafer for each second movement, and determine, based on the second coverage regions, a relative position of the wafer center in the reference die, the relative position corresponding to a maximum number of complete dies in the second coverage regions;
• a determining module, configured to:
• determine a selected die location from a plurality of die locations in a single-shot region, the selected die location corresponding to a minimum number of shots to cover all the dies on the wafer;
• and
• a generation module, configured to:
• determine, based on the relative position of the wafer and the selected die location in the single-shot region, a die layout of the wafer, the die layout comprising a location for each die of the plurality of dies in the wafer.