Back to results
US 11,780,054 B2Granted
Cutting method by using particle beam of metallic glass
AssigneeTaichi Metal Material Technology Co., Ltd.
InventorsKuan-Wei Chen, Kuan-Yu Chen
Life of this patent
Estimating the term…
Abstract
A cutting method by applying a particle beam of metallic glass onto a substrate to cut or partially cut the substrate with high production efficiency, low production cost and better environmental protection.
Claims4
A method comprising:
- driving at least a particle beam composed of particles of metallic glass from a particle feeder to impact or bombard a substrate up to a depth in the substrate;
- wherein said substrate is a wafer;
- and the particle beam is applied to bombard the substrate up to a depth to form a plurality of channels to define a plurality of chips, having a thin bottom layer formed among plural neighboring chips for linking the chips;
- and each said chip is covered with a mask for protecting said chip during bombarding operation;
- and
- wherein said thin bottom layer as formed in said substrate is adapted for a reliable transferring of said substrate, whereby upon peeling and breaking of each said thin bottom layer, said chips may be easily separated one another for further processing;
- and
- wherein said particle beam of particles of metallic glass is driven by a centrifugal particle feeder for centrifugally boosting the particle beam to impact the substrate up to a depth, maintaining said thin bottom layer in said substrate.
5 more elements
A method comprising:
- driving at least a particle beam composed of particles of metallic glass from a particle feeder to impact or bombard a substrate up to a depth in the substrate;
- wherein said substrate is a wafer;
- and the particle beam is applied to bombard the substrate up to a depth, to form a plurality of channels to define a plurality of chips, having a thin bottom layer formed among plural neighboring chips for linking the chips;
- and each said chip is covered with a mask for protecting said chip during bombarding operation;
- and
- wherein said thin bottom layer is adapted for a reliable transferring of said substrate, whereby upon peeling and breaking of each said thin bottom layer, said chips may be easily separated one another for further processing, and
- wherein said particle beam is driven by the particle feeder;
- and a first electrode connected to an upstream of said feeder;
- a second electrode connected to said substrate opposite to said first electrode;
- an electric circuit connected between said first electrode and said second electrode, whereby when said electric circuit is conducted, a voltage is formed between said first electrode and said second electrode for forming charged particles of metallic glass between said first electrode and second electrode;
- and at least an electromagnetic coil surrounding said feeder for accelerating the charged particles towards a downstream of said feeder for impacting said substrate up to a depth, maintaining a thin bottom layer in said substrate.
8 more elements
Dependencies are inferred from the claim text.