US 11,778,912 B2 · Manufacturing method for piezoelectric ceramic chip, piezoelectric ceramic chip assembly and display device

Abstract

The present disclosure provides a manufacturing method for a piezoelectric ceramic chip, a piezoelectric ceramic chip assembly and a display device. The manufacturing method includes: transferring a piezoelectric ceramic layer and a bottom electrode covering the piezoelectric ceramic layer formed on a substrate to a base plate, forming an insulating layer with an opening on the base plate, so that edges of the piezoelectric ceramic layer and the bottom electrode are covered by the insulating layer, and the piezoelectric ceramic layer is exposed from the opening; etching the base plate by immersing the base plate in an etching solution for etching a material of the bottom electrode; and forming a top electrode in the opening of the insulating layer, so that the top electrode is spaced apart from the insulating layer.

Claims15

Dependent claims

A piezoelectric ceramic chip assembly, comprising:

a base plate;
and at least one first piezoelectric ceramic chip, at least one second piezoelectric ceramic chip and an insulating layer with a second opening zone disposed on the base plate;
wherein, the first piezoelectric ceramic chip comprises a first bottom electrode, a first piezoelectric ceramic layer, and a first top electrode stacked on the base plate in sequence;
and
wherein, the second piezoelectric ceramic chip comprises a second top electrode disposed on the base plate, the second top electrode is located in the second opening zone of the insulating layer, and the second top electrode is spaced apart from the insulating layer.

2 more elements

A display panel comprising a base substrate and a piezoelectric ceramic chip assembly, wherein the piezoelectric ceramic chip assembly comprises:

a base plate;
and at least one first piezoelectric ceramic chip, at least one second piezoelectric ceramic chip and an insulating layer with a second opening zone disposed on the base plate;
wherein, the first piezoelectric ceramic chip comprises a first bottom electrode, a first piezoelectric ceramic layer, and a first top electrode stacked on the base plate in sequence;
and
wherein, the second piezoelectric ceramic chip comprises a second top electrode disposed on the base plate, the second top electrode is located in the second opening zone of the insulating layer, and the second top electrode is spaced apart from the insulating layer,
wherein the base substrate is served as the base plate of the piezoelectric ceramic chip assembly.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

17/351,418Filed 18 Jun 2021

Priority

CN 202011296362.118 Nov 2020

Published

US 2022/0158079 A119 May 2022

Granted

3 Oct 2023

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

H10N 30/067
Forming electrodes or interconnections, e.g. leads or terminals: forming single-layered electrodes of multilayered piezoelectric or…
G06F 3/016
Input arrangements or combined input and output arrangements for interaction between user and computer: input arrangements with force or tactile…
H10N 30/072
Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base: by laminating or bonding of piezoelectric…
H10N 30/082
Shaping or machining of piezoelectric or electrostrictive bodies: by etching, e.g. lithography

Manufacturing method for piezoelectric ceramic chip, piezoelectric ceramic chip assembly and display device

Life of this patent

Manufacturing method for piezoelectric ceramic chip, piezoelectric ceramic chip assembly and display device

Life of this patent

Abstract

Claims15