Systems including an integrated power module with vias and methods of forming the same
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsHitoshi Fujioka, Shailesh N. Joshi
Life of this patent
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Abstract
A system includes a power device unit coupled to a substrate. An upper cooling assembly is thermally coupled to an upper side of the substrate. A lower cooling assembly is thermally coupled to a lower side of the substrate. A gate driver unit is coupled to the upper cooling assembly. At least one upper via is formed through the upper cooling electrically coupling the gate driver unit to the power device unit. A capacitor unit is coupled to the lower cooling assembly. At least one lower via formed through the lower cooling assembly electrically coupling the capacitor unit to the power device unit.
Claims20
A system, comprising:
- a power device unit coupled to a substrate;
- an upper cooling assembly thermally coupled to an upper side of the substrate;
- a lower cooling assembly thermally coupled to a lower side of the substrate, the upper cooling assembly and the lower cooling assembly comprising an enclosed chamber, each having a wall contacting the upper and lower sides of the substrate, the wall being lined with a porous metal inverse opal disposed thereon that allows for two phase cooling to be applied on the power device unit;
- a gate driver unit coupled to the upper cooling assembly, at least one upper via formed through the upper cooling assembly electrically coupling the gate driver unit to the power device unit;
- and
- a capacitor unit coupled to the lower cooling assembly, at least one lower via formed through the lower cooling assembly electrically coupling the capacitor unit to the power device unit.
A method, comprising:
- soldering a power device unit to a substrate;
- coupling an upper cooling assembly above the substrate, the upper cooling assembly including at least one upper via and an enclosed chamber having a wall contacting the substrate, the wall being lined with a porous metal inverse opal disposed thereon that allows for two phase cooling to be applied on the power device unit;
- coupling a lower cooling assembly below the substrate, the lower cooling assembly including at least one lower via and an enclosed chamber having a wall contacting the substrate, the wall being lined with a porous metal inverse opal disposed thereon that allows for two phase cooling to be applied on the power device unit;
- electrically coupling the power device unit to a gate driver unit through the at least one upper via;
- electrically coupling the power device unit to a capacitor unit through the at least one lower via.
A system, comprising:
- a power device unit coupled to a substrate;
- an upper cooling assembly thermally coupled to an upper side of the substrate and comprising at least one via pathway and at least one upper via disposed within the at least one via pathway of the upper cooling assembly;
- a lower cooling assembly thermally coupled to a lower side of the substrate and comprising at least one via pathway and a plurality of lower vias disposed within the at least one via pathway of the lower cooling assembly,
- wherein the upper cooling assembly and the lower cooling assembly further comprise an enclosed chamber, each having a wall contacting the upper and lower sides of the substrate, the wall being lined with a porous metal inverse opal disposed thereon that allows for two phase cooling to be applied on the power device unit;
- a gate driver unit coupled to the upper cooling assembly and electrically coupled to the power device unit by the at least one upper via;
- and
- a capacitor unit coupled to the lower cooling assembly and electrically coupled to the power device unit by the plurality of lower vias.
Dependencies are inferred from the claim text.