Constant temperature closed-loop airflow containment

An article of manufacture, comprising:

• a closed-loop cooling system comprising an enclosure, the enclosure inside a data center;
• a set of components in the enclosure, the set of components comprising:
• at least two equipment racks;
• electronic devices mounted on the at least two equipment racks;
• a first heat exchanger;
• and
• airflow moving components configured to:
• circulate air in a closed loop within the enclosure;
• and
• maintain airflow of the circulating air across the electronic devices, wherein the circulating air travels:
• from a front plenum of the enclosure to a rear plenum of the enclosure, crossing the at least two equipment racks,
• from the rear plenum through the first heat exchanger, and
• from the first heat exchanger to the front plenum;
• a second heat exchanger inside the data center, wherein the second heat exchanger is located outside the enclosure;
• a first cooling liquid circulating in a closed loop through the first heat exchanger inside the enclosure and the second heat exchanger outside the enclosure, wherein the first cooling liquid enters the enclosure at an inlet temperature and enters the second heat exchanger from the enclosure at an outlet temperature;
• a second cooling liquid from an external source outside the data center circulating through the second heat exchanger;
• and
• a controller configured to:
• monitor the inlet temperature and the outlet temperature of the first cooling liquid;
• determine, based on the monitoring, that a variation between the inlet temperature and the outlet temperature is greater than a threshold variation;
• and
• adjust the flow rate of the second cooling liquid in response to the determining.

A method, comprising:

• providing a closed-loop cooling system comprising an enclosure, the enclosure inside a data center;
• enclosing a set of components in the enclosure, the set of components comprising:
• at least two equipment racks;
• electronic devices mounted on the at least two equipment racks;
• a first heat exchanger;
• and
• airflow moving components;
• circulating air in a closed loop through the enclosure;
• maintaining, by the airflow components, airflow of the circulating air across the electronic devices, wherein the circulating air travels:
• from a front plenum of the enclosure to a rear plenum of the enclosure, crossing the at least two equipment racks,
• from the rear plenum through the first heat exchanger, and
• from the first heat exchanger to the front plenum;
• providing a second heat exchanger located outside the enclosure;
• circulating a first cooling liquid in a closed loop through the first heat exchanger inside the enclosure and the second heat exchanger outside the enclosure, wherein the first cooling liquid enters the enclosure at an inlet temperature and enters the second heat exchanger from the enclosure at an outlet temperature;
• circulating a second cooling liquid from an external source outside the data center through the second heat exchanger;
• and
• monitoring the inlet temperature and the outlet temperature of the first cooling liquid;
• determining, based on the monitoring, that a variation between the inlet temperature and the outlet temperature is greater than a threshold variation;
• and
• adjusting the flow rate of the second cooling liquid in response to the determining.