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US 11,778,776 B2Granted
Cooling structure
AssigneeResonac Corporation
InventorsHiroaki Shouda, Takahiro Yamashita, Kazutake Fujisawa
Life of this patent
Estimating the term…
Abstract
A cooling structure including a flow path configuration member made of resin and forming a flow path through which a refrigerant flows, a heat diffuser having a plate shape, including a metal, and being embedded in the flow path configuration member or joined to the flow path configuration member, and one or more cooling fins extending from the heat diffuser into the flow path and having a surface made of resin.
Claims20
A cooling structure, comprising:
- a flow path configuration member made of resin and forming a flow path through which a refrigerant can flow;
- a heat diffuser having a plate shape, including a metal, and being embedded in the flow path configuration member or joined to an outer wall of the flow path configuration member without being in contact with the flow path;
- one or more cooling fins extending from the heat diffuser into the flow path and having a surface made of resin;
- and
- a bus bar, which is cooled by transferring heat to the heat diffuser, fixed to a side of the heat diffuser opposite to a side of the heat diffuser on which the one or more cooling fins of the heat diffuser extend.
2 more elements
Dependencies are inferred from the claim text.