Choke structure with water cooling
AssigneePhihong Technology Co., Ltd.
InventorKao-Ping Lo
Life of this patent
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Abstract
A choke structure with water cooling includes a water-cooled device, a choke assembly mounted on the water-cooled device, a ceramic heat spreader with high thermal conductivity set between the choke assembly and the water-cooled device, a metal housing having upper and lower openings installed on the water-cooled device to surround the choke assembly and the ceramic heat spreader with high thermal conductivity, and a printed circuit board is arranged on the upper opening of the metal housing, wherein the generated heat while operating the choke assembly is transmitted through a first heat conduction path formed by the ceramic heat spreader with high thermal conductivity in contact with the choke assembly and the water-cooled device for dissipating heat.
Claims20
A choke structure with water cooling comprising:
- a water-cooled device;
- a choke assembly mounted on the water-cooled device;
- a ceramic heat spreader with high thermal conductivity set between the choke assembly and the water-cooled device;
- a metal housing having upper and lower openings installed on the water-cooled device to surround the choke assembly and the ceramic heat spreader with high thermal conductivity;
- and
- a printed circuit board is arranged on the upper opening of the metal housing, wherein the generated heat while operating the choke assembly is transmitted through a first heat conduction path formed by the ceramic heat spreader with high thermal conductivity in contact with the choke assembly and the water-cooled device for dissipating heat.
A choke structure with water cooling comprising:
- a water-cooled device;
- a choke assembly mounted on the water-cooled device;
- a ceramic heat spreader with high thermal conductivity set between the choke assembly and the water-cooled device, wherein the ceramic heat spreader is an aluminum nitride (AlN) substrate, which has a thermal conductivity of approximately 200 W/(m·K);
- a metal housing having upper and lower openings installed on the water-cooled device to surround the choke assembly and the ceramic heat spreader with high thermal conductivity;
- and
- a printed circuit board is arranged on the upper opening of the metal housing, wherein the generated heat while operating the choke assembly is transmitted through a first heat conduction path formed by the ceramic heat spreader with high thermal conductivity in contact with the choke assembly and the water-cooled device for dissipating heat;
- and
- an electrically insulating spacer installed between the printed circuit board and the upper opening of the metal housing.
A choke structure with water cooling comprising:
- a water-cooled device, wherein the water-cooled device comprising a high thermal conductivity metal base with a plurality of hollow paths parallelly formed inside it;
- and a metal tube with high thermal conductivity bent to pass through the plurality of hollow paths and closely contact with the high thermal conductivity metal base to form a winding cooling path, allowing cooling water to circulate inside the metal tube;
- a choke assembly mounted on the water-cooled device;
- a ceramic heat spreader with high thermal conductivity set between the choke assembly and the water-cooled device;
- a metal housing having upper and lower openings installed on the water-cooled device to surround the choke assembly and the ceramic heat spreader with high thermal conductivity;
- and
- a printed circuit board is arranged on the upper opening of the metal housing, wherein the generated heat while operating the choke assembly is transmitted through a first heat conduction path formed by the ceramic heat spreader with high thermal conductivity in contact with the choke assembly and the water-cooled device for dissipating heat;
- and
- an electrically insulating spacer installed between the printed circuit board and the upper opening of the metal housing.
Dependencies are inferred from the claim text.