Chip packaging structure and display device

A display device, comprising a display panel, a drive printed circuit board, and a chip packaging structure;

• the chip packaging structure comprising at least one chip packaging unit, wherein the chip packaging unit comprises:
• a flexible substrate, the flexible substrate comprising a first flexible substrate body, a plurality of first traces arranged on the first flexible substrate body, and a plurality of input pads and a plurality of output pads arranged on the first flexible substrate body, the plurality of input pads and the plurality of output pads being connected in one-to-one correspondence through the first traces;
• and
• a rigid substrate, the rigid substrate comprising a rigid substrate body and a chip arranged on the rigid substrate body;
• wherein the rigid substrate is bonded to the drive printed circuit board;
• a side of the flexible substrate is bonded to the rigid substrate, and another side of the flexible substrate is bonded to the display panel;
• and the plurality of input pads are electrically connected to the chip, and the plurality of output pads are configured to transmit signals to the display panel.