Component carrier with through hole filled with extra plating structure between sidewalls and plated bridge structure

A method of manufacturing a component carrier, comprising:

• forming a through hole delimited by a sidewall extending between a first main surface and a second main surface of an electrically insulating layer structure so that the through hole has a first tapering portion extending from the first main surface and a second tapering portion extending from the second main surface;
• forming a seed layer directly on the sidewall;
• carrying out a first plating procedure to thereby form a first plating structure on the seed layer on at least part of the sidewall of the electrically insulating layer structure, which sidewall delimits the through hole,
• subsequently carrying out a separate second plating procedure to thereby form a second plating structure which is made of one piece on the first plating structure,
• wherein the second plating structure is integrally formed with an electrically conductive bridge structure connecting the opposing portions of the sidewall;
• wherein the electrically conductive bridge structure is delimited by a concave first demarcation surface facing towards the first main surface and by a concave second demarcation surface facing towards the second main surface.

A component carrier, comprising:

• an electrically insulating layer structure having a first main surface and a second main surface;
• a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface and having a first tapering portion extending from the first main surface and a second tapering portion extending from the second main surface;
• a seed layer directly on at least a part of the through hole in the electrically insulating layer structure;
• a first plating structure on at least part of the seed layer;
• a second plating structure formed separately from and arranged on the first plating structure, wherein the second plating structure is made of one piece and integrally includes an electrically conductive bridge structure connecting opposing portions of a sidewall delimiting the through hole, the second plating structure having opposed concave surfaces that face main surfaces of the component carrier;
• wherein at least a part of the through hole has a central substantially cylindrical portion between the two opposing tapering portions.