Circuit board with embedded electronic component and method for manufacturing the same

A method for manufacturing a circuit board, comprising:

• providing a first single-sided circuit substrate, the first single-sided circuit substrate comprising an insulating base layer and a circuit layer disposed on the insulating base layer;
• providing one of the first single-sided circuit substrate, forming a plurality of first conductive posts electrically connected to the circuit layer in the insulating base layer, thereby obtaining a second single-sided circuit substrate;
• providing a first adhesive layer, forming a plurality of second conductive posts in the first adhesive layer;
• providing one of the second single-sided circuit substrate, defining a receiving groove penetrating the circuit layer and the insulating base layer of the second single-sided circuit substrate, thereby obtaining a third single-sided circuit substrate;
• providing another one of the first single-sided circuit substrate, and mounting an electronic component on the circuit layer, thereby obtaining a surface mounted circuit substrate;
• stacking the first single-sided circuit substrate, the first adhesive layer containing the plurality of second conductive posts, the second single-sided circuit substrate, at least one of the third single-sided circuit substrate, and the surface mounted circuit substrate in that order, causing the receiving groove to correspond to the electronic component, and causing the first single-sided circuit substrate and the insulating base layer of the surface mounted circuit substrate to both face outwards, thereby obtaining an intermediate body;
• and
• pressing the intermediate body, causing the plurality of first conductive posts and the plurality of second conductive posts to electrically connected to both sides of the circuit layer, thereby obtaining the circuit board.