Through-hole via and circuit board

A circuit board comprising:

• a through-hole via penetrating, in a thickness direction, through the circuit board provided with multiple wiring layers in which a conductor pattern is formed on a surface of first insulating layer;
• and
• multiple layers of conductor patterns,
• wherein the through-hole via includes:
• a first through-hole conductor that is disposed inside a hole penetrating through the circuit board and that is formed from a conductor;
• a second through-hole conductor that is disposed inside the hole so as to be spaced, in a circumferential direction of the hole, from the first through-hole conductor;
• a first land portion that connects the first through-hole conductor to the conductor pattern on the first insulating layer;
• and
• a second land portion that connects the first through-hole conductor with the second through-hole conductor on a second insulating layer different from the first insulating layer and on which the conductor pattern is not formed,
• wherein the first land portion is provided so as to surround a periphery of the hole between the first through-hole conductor and the second through-hole conductor, and is formed by cutting away a portion of a ring-shaped conductor on a ring-shaped conductor pattern connecting the first through-hole conductor and the second through-hole conductor to each other, and separating the first through-hole conductor and the second through-hole conductor from each other,
• the second land portion is a ring-shaped conductor pattern that is provided so as to surround the periphery of the hole between the first through-hole conductor and the second through-hole conductor and that connects the first through-hole conductor and the second through-hole conductor to each other,
• the second land portion connects the first through-hole conductor with the second through-hole conductor on the second insulating layer, the second land portion more distant from the first insulating layer than from the second insulating layer, and
• the first through-hole conductor and the second through-hole conductor are formed by forming a slit in a thickness direction of the circuit board in a conductor layer formed so as to be a single tube to separate the first through-hole conductor from the second through-hole conductor.