Signal transmission circuit packaging structure
AssigneeLerain Technology Co., Ltd.
InventorsMiaobin Gao, Chia-Chi Hu
Life of this patent
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AssigneeLerain Technology Co., Ltd.
InventorsMiaobin Gao, Chia-Chi Hu
Estimating the term…
A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins and ground pins. The main circuit unit is arranged in the center of the body. The power pins are arranged in the center of the body. The input pins are arranged at a first side of the body and are electrically connected to the main circuit unit. The output pins are arranged at a side of the body opposite to the first side and are electrically connected to the main circuit unit. The control pins are arranged at a second side of the body and are electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins and the control pins.
A signal transmission circuit packaging structure, comprising:
Dependencies are inferred from the claim text.