Systems and methods for break out of interconnections for high-density integrated circuit packages on a multi-layer printed circuit board

A method for manufacturing a printed circuit board (PCB) including an integrated circuit comprising:

• positioning a first landing pad in a first layer of the PCB and along a first axis extending toward the integrated circuit, the first landing pad arranged to receive a positive signal;
• positioning a second landing pad in the first layer of the PCB and along a second axis extending to the integrated circuit, the second axis being spaced away from the first axis longitudinally in the first layer, the second landing pad arranged to receive a negative signal;
• positioning a first buried via in a second layer of the PCB and along the first axis extending toward the integrated circuit, the first buried via being spaced away from the first landing pad along the first axis;
• positioning a second buried via in the second layer of the PCB and along the second axis extending toward the integrated circuit, the second buried via being spaced away from the second landing pad along the second axis;
• providing a first electrical connection using a first signal connector between the first landing pad and the second buried via;
• and
• providing a second electrical connection using a second signal connector between the second landing pad and the first buried via.