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US 11,778,728 B2Granted
Pass-through latching heat sink
AssigneeARRIS Enterprises LLC
InventorColin Fuller
Life of this patent
Estimating the term…
Abstract
An assembly configured to dissipate heat in a gateway, the assembly including: a bracket, the bracket including one or more openings extending from a front side to a back side of the vertically oriented bracket; and a plurality of heat sink fins attached to a base member, and wherein the base member is configured to be attachable to a front side of the bracket and the plurality of heat sink fins extend through the one or more openings to a back side of the bracket.
Claims19
An assembly configured to dissipate heat in a gateway, the assembly comprising:
- a vertically oriented main printed circuit board with one or more components;
- a vertically oriented Wi-Fi printed circuit board with one or more front-end modules configured to deliver broadband wireless access;
- and
- a bracket, the bracket including one or more openings extending from a front side to a back side of the bracket;
- and
- a plurality of heat sink fins attached to a base member, and wherein the base member is configured to be attachable to the front side of the bracket and the plurality of heat sink fins extend through the one or more openings to the back side of the bracket,
- wherein the bracket is a vertically oriented bracket arranged between the vertically oriented main printed circuit board and the vertically oriented Wi-Fi printed circuit board, the plurality of heat sink fins being attached to two or more base members, and wherein each of the two or more base members with the plurality of heat sink fins is arranged horizontally on the bracket on a side of the vertically oriented Wi-Fi printed circuit board and the plurality of fins extending into a gap between the vertically oriented bracket and the vertically oriented main printed circuit board.
4 more elements
An assembly comprising:
- a vertically oriented main printed circuit board;
- a vertically oriented Wi-Fi printed circuit board with one or more front-end modules configured to deliver broadband wireless access;
- a vertically oriented bracket arranged between the vertically oriented main printed circuit board and the vertically oriented Wi-Fi printed circuit board, the bracket including one or more openings extending from a front side to a back side of the vertically oriented bracket;
- and
- a plurality of heat sink fins attached to a base member, and wherein the base member is configured to be attachable to the front side of the bracket and the plurality of heat sink fins extend through the one or more openings to the back side of the bracket, the front side of the bracket being on a side of the vertically oriented Wi-Fi printed circuit board and the back side being on a side of the vertically oriented main printed circuit board.
2 more elements
Dependencies are inferred from the claim text.