Semiconductor package assembly and method of manufacturing the same

A semiconductor package assembly, comprising:

• a circuit board, comprising a conductive pattern and conductive contacts surrounded by the conductive pattern;
• a plurality of cooling modules, standing on and thermally coupled to the conductive pattern;
• a socket, located on the circuit board and connected to the conductive pattern and the conductive contacts, wherein the socket is surrounded by the plurality of cooling modules;
• and
• a semiconductor package, located on and connected to the socket, wherein the semiconductor package is thermally connected to the plurality of cooling modules through the conductive pattern and the socket and is electrically connected to the circuit board through the conductive contacts and the socket.

A method of manufacturing a semiconductor package assembly, comprising:

• providing a circuit board comprising a conductive pattern;
• mounting a heat dissipating element over the circuit board, the heat dissipating element being connected to the conductive pattern;
• mounting a semiconductor device over the circuit board, the semiconductor device being located next to the heat dissipating element in a lateral direction, and the semiconductor device being thermally connected to the heat dissipating element through the conductive pattern;
• and
• disposing a socket on the circuit board, the socket being located next to the heat dissipating element in the lateral direction and between the semiconductor device and the circuit board in a vertical direction.