Camera module and electronic device having the camera module
AssigneeTriple Win Technology(Shenzhen) Co. Ltd.
InventorsJian-Chao Song, Shin-Wen Chen, Sheng-Jie Ding, Jing-Wei Li, Ding-Nan Huang
Life of this patent
Estimating the term…
Abstract
A camera module includes a circuit board, a photosensitive chip, a filter, a lens base, and a lens. The photosensitive chip is mounted on the circuit board. The lens base is mounted on the circuit board and receives the photosensitive chip therein. The filter is mounted in the lens base and positioned above the photosensitive chip. The lens is mounted in the lens base and positioned above the photosensitive chip. A dust-absorbing film is arranged in the lens base and located above the filter. An electronic device having the camera module is also provided.
Claims16
A camera module comprising:
- a circuit board;
- a photosensitive chip;
- a filter;
- a lens base;
- and
- a lens;
- wherein the photosensitive chip is mounted on the circuit board, the lens base is mounted on the circuit board and receives the photosensitive chip therein, the filter is mounted in the lens base and positioned above the photosensitive chip, the lens is mounted in the lens base and positioned above the photosensitive chip, a dust-absorbing film is arranged in the lens base and located above the filter, the dust-absorbing film comprises a base layer made of silicon dioxide or titanium dioxide and a water-based protective layer on a surface of the base layer facing away from the circuit board.
An electronic device comprising:
- a filter;
- a lens base;
- and
- a lens;
- wherein the photosensitive chip is mounted on the circuit board, the lens base is mounted on the circuit board and receives the photosensitive chip therein, the filter is mounted in the lens base and positioned above the photosensitive chip, the lens is mounted in the lens base and positioned above the photosensitive chip, a dust-absorbing film is arranged in the lens base and located above the filter, the dust-absorbing film comprises a base layer made of silicon dioxide or titanium dioxide and a water-based protective layer on a surface of the base layer facing away from the circuit board.
Dependencies are inferred from the claim text.