Circuit board, camera assembly having the circuit board, and electronic device having the circuit board
AssigneeTriple Win Technology(Shenzhen) Co.Ltd.
InventorChia-Weng Hsu
Life of this patent
Estimating the term…
Abstract
A circuit board includes a circuit substrate, a first solder mask, and a plurality of heat dissipation fins. The circuit substrate includes a first surface. The first solder mask is arranged on the first surface. The plurality of heat dissipation fins are arranged on a surface of the first solder mask facing away from the first surface. A heat dissipation channel is formed between any two adjacent of the plurality of heat dissipation fins. A camera assembly having the circuit board and an electronic device having the circuit board are also provided.
Claims18
A circuit board comprising:
- a circuit substrate comprising a first surface;
- a first solder mask on the first surface;
- a plurality of heat dissipation fins arranged on a surface of the first solder mask facing away from the first surface;
- wherein a heat dissipation channel is formed between any two adjacent of the plurality of heat dissipation fins.
A camera assembly comprising:
- a circuit board comprising:
- a circuit substrate comprising a first surface;
- a first solder mask on the first surface;
- a plurality of heat dissipation fins arranged on a surface of the first solder mask facing away from the first surface;
- wherein a heat dissipation channel is formed between any two adjacent of the plurality of heat dissipation fins;
- a photosensitive chip on a second surface of the circuit substrate facing away from the first surface;
- a lens base on the second surface of the circuit substrate and covering the photosensitive chip;
- and
- a lens module at a side of the lens base facing away from the circuit board.
An electronic device comprising:
- a camera assembly comprising:
- a circuit board comprising:
- a circuit substrate comprising a first surface;
- a first solder mask on the first surface;
- a plurality of heat dissipation fins arranged on a surface of the first solder mask facing away from the first surface;
- wherein a heat dissipation channel is formed between any two adjacent of the plurality of heat dissipation fins.
Dependencies are inferred from the claim text.