In-packaged multi-channel light engine on single substrate

An integrated circuit assembly comprising:

• a plurality of light engines, each of the plurality of light engines comprising:
• a first substrate having a first surface and a second surface opposite the first surface, the first substrate comprising first through substrate vias (TSVs) extending between the first surface and the second surface and further comprising a first integrated circuit mounted on the second surface, the first integrated circuit being connected to the first TSVs;
• and
• a silicon photonics substrate having a third surface and a fourth surface opposite the third surface, the fourth surface facing the first surface of the first substrate, the silicon photonics substrate comprising second TSVs extending between the third surface and the fourth surface and connected to the first TSVs of the first substrate, the silicon photonics substrate further comprising a plurality of optical devices and a plurality of integrated circuit devices mounted on the third surface and connected to the second TSVs;
• an interposer having a fifth surface and a sixth surface opposite the fifth surface and comprising a plurality of sets of TSVs, each set of TSVs defined by a plurality of TSVs, respective TSVs extending between the fifth surface and the sixth surface;
• wherein the plurality of the light engines of is mounted on the interposer with the second surface of the first substrate facing the fifth surface of the interposer, the second TSVs of each of the light engines being connected to a respective set of TSVs among the plurality of sets of TSVs of the interposer;
• and
• a second substrate having a plurality of sets of electrical contacts connected to corresponding sets of TSVs among the plurality of set of TSVs of the interposer.