Bonded substrate, surface acoustic wave element, surface acoustic wave element device, and bonded substrate manufacturing method
AssigneeThe Japan Steel Works, Ltd.
InventorsKouhei Kurimoto, Kazuhito Kishida, Rinzo Kayano, Jun Mizuno, Shoji Kakio
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Abstract
A bonded substrate includes a quartz substrate and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded by covalently coupling at a bonding interface, and an orientation of the quartz substrate and an orientation of the piezoelectric substrate intersect with each other on an orthogonal direction side or in the range of 65 degrees to 115 degrees in a bonding surface direction.
Claims19
A bonded substrate comprising:
- a quartz substrate;
- and
- a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates,
- wherein
- the quartz substrate and the piezoelectric substrate are bonded by covalently coupling at a bonding interface;
- and
- a crystal orientation of the quartz substrate and a crystal orientation of the piezoelectric substrate intersect with each other on an orthogonal direction side in a bonding surface direction.
A bonded substrate comprising:
- a quartz substrate;
- and
- a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates,
- wherein
- the quartz substrate and the piezoelectric substrate are bonded by covalently coupling at a bonding interface;
- and
- a crystal orientation of the quartz substrate and crystal orientation of the piezoelectric substrate intersect with each other in the range of 65 degrees to 115 degrees in a bonding surface direction.
Dependencies are inferred from the claim text.