Packaged surface acoustic wave devices
AssigneeSkyworks Solutions, Inc.
InventorsLi Ann Koo, Takashi Inoue, Vivian Sing Zhi Lee, Ping Yi Tan
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Abstract
Packaged surface acoustic wave devices are provided. The packaged surface acoustic wave devices are relatively thin and can have a height of less than 220 micrometers. The packaged surface acoustic wave device includes a photosensitive resin over a conductive structure which may be formed by a plating process. The conductive structure may overlie a cavity-defining structure encapsulating a surface acoustic wave device, the cavity-defining structure including walls and a roof. The photosensitive resin can include a phenol resin. The photosensitive resin can be relatively thin. Edge portions of a piezoelectric substrate can be free from the photosensitive resin.
Claims20
A packaged surface acoustic wave device comprising:
- a cavity roof over an interdigital transducer electrode of a surface acoustic wave device;
- a conductive structure over the cavity roof;
- and
- a photosensitive buffer coat layer over the conductive structure, the packaged surface acoustic wave device having a height of 220 micrometers or less.
A packaged surface acoustic wave device comprising:
- a cavity structure supported by a die and cooperating the die to encapsulate an interdigital transducer electrode of a surface acoustic wave device;
- a conductive structure extending over a portion of an outer surface of the cavity structure;
- and
- an insulating layer extending over the conductive structure, a portion of the insulating layer overlying a portion of the conductive structure having a thickness of less than 15 micrometers.
A packaged surface acoustic wave device comprising:
- a piezoelectric substrate;
- a packaging structure supported by a first surface of the piezoelectric substrate and defining a cavity, the packaging structure including an outer layer including photosensitive resin and a conductive layer at least partially between the cavity and the photosensitive resin;
- and
- a plurality of interdigital transducer electrodes supported by the piezoelectric substrate and located within the cavity, the plurality of interdigital transducer electrodes including a first interdigital transducer electrode of a first resonator and a second interdigital transducer electrode of a second resonator.
Dependencies are inferred from the claim text.