Package

An electronic device comprising one of a telecommunication radio interface and a radar system, the electronic device comprising:

• an integrated circuit, IC, die comprising circuitry configured to one or more of generate signalling for transmission to a waveguide and receive signalling from a waveguide, via a launcher, the die coupled to an interconnect layer extending out from a footprint of the die;
• and
• the launcher is formed in a launcher-substrate, separate from the IC die, the launcher coupled to the IC die to pass said signalling therebetween by a connection in said interconnect layer, wherein said launcher comprises a launcher element mounted in a first plane within the launcher-substrate and a waveguide-cavity comprising a ground plane arranged opposed to and spaced from the first plane, the waveguide-cavity further defined by at least one side wall extending from the ground plane towards the first plane;
• and
• wherein said die and said launcher are at least partially surrounded by mould material of said package.