Apparatus, system, and method for transferring radio frequency signals between waveguides and radiating elements in antennas
AssigneeMeta Platforms, Inc.
InventorsQi Tang, Srishti Saraswat, Farbod Tabatabai
Life of this patent
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Abstract
A radio frequency coupling structure comprising (1) a substrate that forms a top side of a waveguide, (2) a first conductive layer disposed on a bottom side of the substrate, (3) a second conductive layer incorporated within the substrate, (4) a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate, and/or (5) a ring slot formed around the through via in the first conductive layer. Various other apparatuses, systems, and methods are also disclosed.
Claims20
A radio frequency coupling structure comprising:
- a substrate that forms a top side of a waveguide;
- a first conductive layer disposed on a bottom side of the substrate;
- a second conductive layer incorporated within the substrate;
- a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate;
- and
- a ring slot formed around the through via in the first conductive layer.
An antenna comprising:
- a bottom Radio Frequency (RF) guide plate rotatably coupled to a base via a first shaft controlled by an azimuth motor;
- a top array plate rotatably coupled to the base via a second shaft controlled by an elevation motor, the top array plate and the bottom RF guide plate collectively forming a waveguide configured to direct radio frequency signals in a specific direction;
- and
- a plurality of radio frequency coupling structures disposed on a substrate of the top array plate, the plurality of radio frequency coupling structures comprising:
- a first conductive layer disposed on a bottom side of the substrate;
- a second conductive layer incorporated within the substrate;
- a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate;
- and
- a ring slot formed around the through via in the first conductive layer.
A method comprising:
- fabricating, on a substrate that forms a top side of a waveguide, a through via that is communicatively coupled to a first conductive layer disposed on a bottom side of the substrate;
- extending the through via from the first conductive layer through an opening in a second conductive layer incorporated within the substrate toward a top side of the substrate;
- fabricating, in the first conductive layer, a ring slot that substantially surrounds the through via and exposes the substrate to the waveguide;
- and
- fabricating a plurality of cavity vias that:
- are communicatively coupled between the first conductive layer and the second conductive layer;
- and
- are arranged radially around the ring slot and the through via within the substrate.
Dependencies are inferred from the claim text.