Semiconductor device package and method of manufacturing the same

A wireless communication module, comprising:

• a carrier including a first surface and a second surface non-parallel with the first surface;
• a substrate comprising a first portion disposed over the first surface of the carrier and a second portion disposed over the second surface of the carrier, the first portion including a first antenna layer, and the second portion including a second antenna layer,
• wherein the first antenna layer is configured to radiate a first electromagnetic wave in a first direction, and the second antenna layer is configured to radiate a second electromagnetic wave in a second direction,
• wherein the first antenna layer and the second antenna layer are collectively configured as a first antenna array to transmit or receive a third electromagnetic wave through far-field interference between the first electromagnetic wave and the second electromagnetic wave in a third direction different from the first direction and the second direction,
• wherein the first antenna layer includes a first patterned antenna and a second patterned antenna, the first patterned antenna is closest to the second antenna layer,
• wherein the second antenna layer includes a third patterned antenna which is closest to the first antenna layer, and
• wherein a first pitch between the first patterned antenna and the third patterned antenna is in a range from 0.5λ to 0.9λ, and substantially equal to a second pitch between the first patterned antenna and the second patterned antenna of the first antenna layer.