Header for a package including an electronic component for radio frequency signal transmission

A packaged electronic component, comprising:

• a header for an electronic component for radio frequency data transfer, the header including:
• a metallic base body including a plurality of electrical feedthroughs;
• a thermoelectric cooling element having a first side bearing on the metallic base body and an opposite second side for mounting the electronic component;
• a radio frequency line configured for being to the electronic component is provided on the second side for mounting the electronic component, the radio frequency line including a ground conductor that is electrically connected to the metallic base body by way of an electrical connection, the electrical connection to the metallic base body including a telluride element.

A method for producing a header for an electronic component for radio frequency data transfer, the method comprising the steps of:

• providing a metallic base body that has a plurality of electrical feedthroughs;
• connecting a first side of a thermoelectric cooling element to the metallic base body;
• and
• mounting an electronic component on an opposite second side of the thermoelectric cooling element, the second side for mounting the electronic component having an electrical contact which is electrically connected to the metallic base body by way of an electrical connection which provides a ground conductor connection of a radio frequency line to the electronic component, the electrical connection being made via a telluride element.