Cooling in a waveguide arrangement
AssigneeTelefonaktiebolaget LM Ericsson (publ)
InventorsAnatoli Deleniv, Per Ingelhag, Peter Melin
Life of this patent
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Abstract
The present disclosure relates to a waveguide arrangement including a mounting printed circuit board, PCB, and at least a first waveguide layer. Each waveguide layer comprises at least a first waveguide conducting tube, each waveguide conducting tube having an electrically conducting inner wall. The PCB includes a signal interface for each waveguide conducting tube. The waveguide arrangement further includes at least a first coupling layer that is positioned between the PCB and the first waveguide conducting tube such that at least the first waveguide conducting tube of the first waveguide layer is connected to the corresponding signal interface via the first coupling layer.
Claims15
A waveguide arrangement comprising a mounting printed circuit board, PCB, and at least a first waveguide layer, where each waveguide layer in turn comprises at least a first waveguide conducting tube, each waveguide conducting tube having an electrically conducting inner wall, where the PCB comprises a signal interface for each waveguide conducting tube, wherein the waveguide arrangement further comprises at least a first coupling layer that is positioned between the PCB and the first waveguide conducting tube such that at least the first waveguide conducting tube of the first waveguide layer is connected to the corresponding signal interface via the first coupling layer, where each coupling layer comprises air passages that enable air to pass through the coupling layer, wherein the waveguide arrangement comprises at least one further waveguide layer and at least one further coupling layer, where each further coupling layer is positioned between two adjacent waveguide layers such that a stacked structure is formed where the waveguide layers and the coupling layers together define at least one resulting waveguide conducting tube.
A coupling layer that is adapted to be mounted adjacent at least one waveguide layer, the coupling layer comprising at least one waveguide conducting tube with an electrically conducting inner wall, where the coupling layer comprises air passages that enable air to pass through the coupling layer and is adapted to be positioned between one waveguide layer and a mounting printed circuit board, PCB, wherein the coupling layer comprises a frame and rows of pins protruding in opposite directions from the frame, where a row of pins is adapted to press-fit into a corresponding groove comprised in an adjacent waveguide layer.
A method of configuring a waveguide arrangement comprising at least a first waveguide layer, where each waveguide layer in turn comprises at least a first waveguide conducting tube, each waveguide conducting tube having an electrically conducting inner wall, where the method comprises:
- arranging (S1) one signal interface for each waveguide conducting tube on a mounting printed circuit board, PCB;
- and
- arranging (S2) one or more waveguide layers in an interleaved manner with at least a first coupling layer on the PCB so as to form the waveguide arrangement, such that each waveguide conducting tube of the first waveguide layer is connected to the corresponding signal interface via the first coupling layer, where each coupling layer comprises air passages that enable air to pass through the coupling layer;
- and
- using at least one further waveguide layer and at least one further coupling layer to position each further coupling layer between two adjacent waveguide layers such that a stacked structure is formed, the waveguide layers and the coupling layers together defining at least one resulting waveguide conducting tube.
Dependencies are inferred from the claim text.