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US 11,777,068 B2Granted
Semiconductor light emitting device and method for manufacturing the same
AssigneeRohm Co., Ltd.
InventorsMasahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
Life of this patent
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Abstract
A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
Claims20
A light-emitting device comprising:
- first, second and third conductors disposed on a common plane and spaced apart from each other;
- a first protection element mounted on the first conductor;
- a second protection element mounted on the second conductor;
- a first light-emitting element mounted on the third conductor;
- and
- a resin member supporting the first, second and third conductors, the first light-emitting element, the first protection element and the second protection element,
- wherein as viewed in a first direction parallel to the common plane, the first light-emitting element is disposed between the first protection element and the second protection element.
4 more elements
Dependencies are inferred from the claim text.