Spherical LED chip, method for manufacturing the same, display panel, and method for spherical LED chip transfer

A display panel, comprising:

• a back plate;
• a plurality of spherical light-emitting diode (LED) chips arranged on the back plate, each of the plurality of spherical LED chips comprising:
• a first electrode;
• a second electrode surrounding the first electrode and having magnetism;
• and
• a first insulating protective layer arranged at the outside of the first electrode, wherein the first insulating protective layer and the second electrode form an LED housing configured to wrap the first electrode and with a spherical outer contour;
• a first metal pad arranged in the back plate and configured to be connected with the first electrode;
• and
• a second metal pad arranged in the back plate and configured to be connected with the second electrode, wherein the second metal pad has magnetism opposite to that of the second electrode.

A method for spherical light-emitting diode (LED) chip transfer, comprising:

• placing a plurality of spherical LEDs in a suspension, wherein each of the plurality of spherical LEDs comprises:
• a first electrode;
• a second electrode surrounding the first electrode and having magnetism;
• and
• a first insulating protective layer arranged at the outside of the first electrode, wherein
• the first insulating protective layer and the second electrode form an LED housing configured to wrap the first electrode and with a spherical outer contour;
• placing a back plate in the suspension to make the plurality of spherical LEDs float above the back plate, wherein the back plate defines a plurality of grooves, a second metal pad is arranged on the back plate, and the second metal pad has magnetism opposite to that of the second electrode;
• and
• transferring, via magnetism between the second electrode and the second metal pad, the plurality of spherical LEDs onto the plurality of grooves of the back plate.