Eliminating interconnect strains in microcircuits
AssigneeRaytheon Company
InventorsPaul A. Drake, Christopher Moshenrose, Heather D. Leifeste
Life of this patent
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Abstract
A method of eliminating interconnect strains in a stack-up is provided. The method includes providing a detector portion including a detector substrate and detector layers, providing a read-out integrated circuit (ROIC) stack-up including ROIC layers and an initial ROIC substrate, removing the initial ROIC substrate from the ROIC layers, attaching a new ROIC substrate to a first surface of the ROIC layers, the new ROIC substrate having a coefficient of thermal expansion (CTE) that matches a CTE of the detector substrate and hybridizing the detector layers to a second surface of the ROIC layers by way of interconnects.
Claims6
A stack-up assembly, comprising:
- a detector portion comprising a detector substrate and a detector layers;
- a read-out integrated circuit (ROIC) stack-up comprising a ROIC layers, a thinned initial ROIC substrate and a new ROIC substrate attached to the thinned initial ROIC substrate, the new ROIC substrate having a coefficient of thermal expansion (CTE) that matches a CTE of the detector substrate;
- and
- interconnects by which the detector layer is hybridized to an exposed surface of the ROIC layer,
- wherein the new ROIC substrate comprises cadmium-zinc-tellurium and the CTE of the new ROIC substrate exactly matches the CTE of the detector substrate.
A stack-up assembly, comprising:
- a detector portion comprising a detector substrate and a detector layer;
- a read-out integrated circuit (ROIC) stack-up comprising a ROIC layer, a thinned initial ROIC substrate and a new ROIC substrate attached to the thinned initial ROIC substrate, the new ROIC substrate having a coefficient of thermal expansion (CTE) that matches a CTE of the detector substrate;
- and
- interconnects by which the detector layer is hybridized to an exposed surface of the ROIC layer,
- wherein the detector substrate and the new ROIC substrate each consist of cadmium-zinctellurium.
Dependencies are inferred from the claim text.