Solid-state image pickup device and electronic apparatus having a separation wall between the first photodiode and the second photodiode
AssigneeSony Group Corporation
InventorsAtsushi Masagaki, Yusuke Tanaka
Life of this patent
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Abstract
The present disclosure relates to a solid-state image pickup device and an electronic apparatus that are capable of preventing leakage of charges between adjacent pixels. A plurality of pixels perform photoelectric conversion on light incident from a back surface via different on-chip lenses for each pixel. A pixel separation wall is formed between pixels adjacent to each other, and includes a front-side trench formed from a front surface and a backside trench formed from the back surface. A wiring layer is provided on the front surface. The present disclosure is applicable to, for example, a backside illuminated CMOS image sensor.
Claims7
A light detecting device, comprising a pixel comprising:
- a first photodiode and a second photodiode disposed in a semiconductor substrate;
- a divided pixel separation wall disposed in the semiconductor substrate and disposed between the first photodiode and the second photodiode;
- and
- an impurity disposed in the semiconductor substrate and disposed between the first photodiode and the second photodiode,
- wherein the divided pixel separation wall reaches to each of a first surface and a second surface of the semiconductor substrate, the first surface being opposite to the second surface.
Dependencies are inferred from the claim text.