Sensor package structure

A sensor package structure, comprising:

• a substrate having a first surface and a second surface that is opposite to the first surface;
• a sensor chip disposed on the first surface of the substrate;
• a plurality of wires electrically coupled to the sensor chip and the substrate, wherein two ends of each of the wires are respectively connected to the first surface of the substrate and an upper surface of the sensor chip;
• a light-permeable layer arranged above the sensor chip and having a top surface, a bottom surface, and a plurality of lateral surfaces that are connected to the top surface and the bottom surface, wherein the bottom surface of the light-permeable layer faces toward the upper surface of the sensor chip;
• and
• a colloid formed on the first surface of the substrate to fix the light-permeable layer, wherein the wires and a peripheral portion of the sensor chip are embedded in the colloid, the lateral surfaces of the light-permeable layer are covered by the colloid, and the top surface of the light-permeable layer is exposed from the colloid, and wherein an upper portion of a top curved surface of the colloid is arranged in a space defined by virtually extending the lateral surfaces of the light-permeable layer along a distribution direction parallel to the substrate, and another portion of the top curved surface other than the upper portion is arranged outside of the space;
• wherein, in a cross section of the sensor package structure perpendicular to the distribution direction, the top curved surface has a reference point spaced apart from one of the lateral surfaces adjacent thereto by 100 μm, a top edge of the top curved surface and the reference point jointly define a connection line, and the connection line and the one of the lateral surfaces have an acute angle there-between that is within a range from 25 degrees to 36 degrees.