Semiconductor device having buried logic conductor type of complementary field effect transistor, method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsGuo-Huei Wu, Pochun Wang, Chih-Liang Chen, Li-Chun Tien
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a buried communication (com) conductor (BC) CFET including: first and second active regions arranged in a stack according to CFET-type configuration; a first layer of metallization (M_1st layer) over the stack which includes first conductors configured for data or control signals (communication (com) conductors), and power grid (PG) conductors; and a layer of metallization (M_B layer) below the stack and which includes second com conductors.
Claims20
A semiconductor device comprising a buried logic conductor (BLC) CFET including:
- a complementary field effect transistor (CFET) including active regions arranged in a stack relative to a first direction;
- relative to the first direction, a first layer of metallization (M_1st layer) over the CFET which includes:
- alpha logic conductors configured for logic signals (alpha logic conductors);
- and
- power grid (PG) conductors;
- and
- relative to the first direction, a layer of metallization (M_B layer) below the CFET which includes:
- beta logic conductors;
- the alpha logic, beta logic and PG conductors extending in a second direction which is perpendicular to the first direction;
- and
- relative to a zone defined in terms of a third direction which is perpendicular to each of the first and second directions:
- the zone being occupied by the alpha logic and PG conductors;
- and
- each of the CFET and the beta logic conductors overlapping the zone.
A semiconductor device comprising a buried communication (com) conductor (BC) CFET including:
- first and second active regions arranged in a stack according to CFET-type configuration;
- a first layer of metallization (M_1st layer) over the stack which includes:
- first conductors configured for data or control signals (communication (com) conductors);
- and
- power grid (PG) conductors;
- and
- a layer of metallization (M_B layer) below the stack and which includes second corn conductors.
A method of manufacturing a semiconductor device which includes a buried logic conductor (BLC) CFET region, the method comprising:
- forming first and second active regions arranged in a first stack with the second active region over the first active region;
- forming source/drain (S/D) regions including doping first areas of the active regions, the S/D regions representing first transistor-components, wherein second areas of the active regions which are between corresponding S/D regions are channel regions representing second transistor-components;
- forming a gate structure proximal to the first and second active regions;
- forming metal-to-S/D (MD) contact structures over corresponding ones of the S/D regions, the MD contact structures representing fourth transistor-components;
- and
- forming alpha logic conductors and power grid (PG) conductors which are in a first layer of metallization, which are correspondingly over the gate structure, and which are non-overlapping of each other;
- forming beta logic conductors which are in a buried layer of metallization, which are correspondingly under the gate structure, and which are non-overlapping of each other, and represent corresponding beta logic conductors in a buried layer of metallization.
Dependencies are inferred from the claim text.