Integrated circuit filler and method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang, Geng-He Lin
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang, Geng-He Lin
Estimating the term…
Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.
An integrated circuit, comprising:
A semiconductor device, comprising:
A memory circuit, comprising:
Dependencies are inferred from the claim text.