Back to results
US 11,776,947 B2Granted
Electronic component and manufacturing method therefor
AssigneeTDK Corporation
InventorsYusuke Oba, Kenichi Yoshida, Takashi Ohtsuka, Yuichiro Okuyama, Tomoya Hanai, Yu Fukae
Life of this patent
Estimating the term…
Abstract
Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.
Claims3
An electronic component comprising:
- a substrate;
- a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, the functional layer including at least one of a capacitor and an inductor;
- a plurality of terminal electrodes provided on an uppermost one of the insulating layers,
- wherein the uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view, and
- wherein the protruding part is positioned in substantially a center portion of one side.
2 more elements
Dependencies are inferred from the claim text.