Method of manufacturing package-on-package device and bonding apparatus used therein

A package-on-package bonding apparatus comprising:

• a stage receiving a semiconductor package and an interposer substrate on the semiconductor package, the semiconductor package comprising a semiconductor chip smaller than the interposer substrate;
• an optical system disposed on the stage and configured to irradiate the interposer substrate with a laser beam, the optical system comprising an objective providing the laser beam to the interposer substrate;
• and
• a pressing member between the interposer substrate and the objective and pressing the interposer substrate against the semiconductor package, the pressing member blocking the laser beam traveling toward the semiconductor chip to selectively provide the laser beam to a portion of the semiconductor package, wherein:
• the pressing member comprises:
• a pressing plate covering the interposer substrate and transmitting the laser beam, the pressing plate being wider than the objective;
• and
• a pressing block disposed on the pressing plate to absorb and, thereby, block the laser beam traveling toward the center of the interposer substrate, the pressing block being narrower than the objective and aligned with the semiconductor chip.

A package-on-package bonding apparatus comprising:

• a stage receiving a semiconductor package and an interposer substrate on the semiconductor package, the semiconductor package comprising a semiconductor chip smaller than the interposer substrate;
• an optical system disposed on the stage and configured to irradiate the interposer substrate with a laser beam;
• and
• a pressing member between the interposer substrate and the optical system and pressing the interposer substrate against the semiconductor package, the pressing member blocking the laser beam traveling toward the semiconductor chip to selectively provide the laser beam to a portion of the semiconductor package, wherein:
• the pressing member comprises:
• a pressing plate covering the interposer substrate and transmitting the laser beam, the pressing plate having a cavity;
• and
• a pressing block disposed in the cavity of the pressing plate and blocking the laser beam, the pressing block being narrower than the pressing plate.