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US 11,776,941 B2Granted
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsYonghoe Cho, Sunkyoung Seo, Chajea Jo
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a package substrate, a connection substrate on the package substrate, a first image sensor chip on the connection substrate, a second image sensor chip on the connection substrate, the second image sensor chip being horizontally spaced apart from the first image sensor chip, and a memory chip disposed on the package substrate and electrically connected to the first image sensor chip through the connection substrate. A distance between the first image sensor chip and the second image sensor chip is less than a thickness of the first image sensor chip.
Claims20
A semiconductor package comprising:
- a package substrate;
- a connection substrate on the package substrate;
- a first image sensor chip on the connection substrate;
- a second image sensor chip on the connection substrate, the second image sensor chip being horizontally spaced apart from the first image sensor chip;
- a plurality of lenses including first and second lenses vertically overlapping the first and second image sensor chips respectively;
- a lens holder supporting the plurality of lenses;
- and
- a memory chip disposed on the package substrate and electrically connected to the first image sensor chip through the connection substrate,
- wherein the lens holder comprises sidewalls extending vertically from a top surface of the connection substrate and an upper portion extending horizontally from the sidewalls and holding the plurality of lenses such that the lens holder and the plurality of lenses together with the connection substrate enclose the first and second image sensor chips,
- wherein the upper portion of the lens holder is disposed at the same height as the plurality of lenses,
- wherein a portion of the lens holder is interposed between the plurality of lenses,
- wherein the portion of the lens holder contacts the plurality of lenses, and
- wherein a distance between the first image sensor chip and the second image sensor chip is less than a vertical thickness of the first image sensor chip.
10 more elements
A semiconductor package comprising:
- a package substrate;
- a connection substrate disposed on the package substrate, the connection substrate comprising:
- a support layer;
- a through-electrode vertically penetrating the support layer;
- and a redistribution layer electrically connected to the through-electrode;
- a first image sensor chip mounted on the redistribution layer;
- a second image sensor chip mounted on the redistribution layer and horizontally spaced apart from the first image sensor chip;
- a first semiconductor chip disposed on the package substrate and electrically connected to the first image sensor chip through the connection substrate;
- a second semiconductor chip disposed on the package substrate and electrically connected to the first image sensor chip through the connection substrate;
- and
- a lens holder supporting first and second lenses vertically overlapping the first and second image sensor chips respectively,
- wherein the lens holder comprises sidewalls extending vertically from a top surface of the connection substrate and an upper portion extending horizontally from the sidewalls and holding the first and second lenses such that the lens holder and the first and second lenses together with the connection substrate enclose the first and second image sensor chips,
- wherein the upper portion of the lens holder is disposed at the same height as the first and second lenses,
- wherein a portion of the lens holder is interposed between the first and second lenses,
- wherein the portion of the lens holder contacts the first and second lenses, and
- wherein a distance between the first image sensor chip and the second image sensor chip is less than a distance between the first semiconductor chip and the second semiconductor chip.
13 more elements
A semiconductor package comprising:
- a package substrate;
- a connection substrate on the package substrate;
- a first image sensor chip on the connection substrate;
- a second image sensor chip horizontally spaced apart from the first image sensor chip on the connection substrate;
- a plurality of lenses including first and second lenses vertically overlapping the first and second image sensor chips respectively;
- a lens holder supporting the plurality of lenses;
- a memory chip disposed on the package substrate and electrically connected to the first image sensor chip through the connection substrate;
- and
- a logic chip disposed on the package substrate and horizontally spaced apart from the memory chip,
- wherein the lens holder comprises sidewalls extending vertically from a top surface of the package substrate and an upper portion extending horizontally from the sidewalls and holding the plurality of lenses such that the lens holder and the plurality of lenses together with the package substrate enclose the first and second image sensor chips,
- wherein the upper portion of the lens holder is disposed at the same height as the plurality of lenses,
- wherein a portion of the lens holder is interposed between the plurality of lenses,
- wherein the portion of the lens holder contacts the plurality of lenses, and
- wherein a distance between the first image sensor chip and the second image sensor chip is less than a distance between the memory chip and the logic chip.
11 more elements
Dependencies are inferred from the claim text.