Electronic power module
AssigneeKyocera AVX Components (Salzburg) GmbH
InventorLouis Costa
Life of this patent
Estimating the term…
Abstract
Electronic power modules are disclosed. In one example, an electronic power module includes a first aluminum substrate, a second aluminum substrate, and a third aluminum substrate arranged in a common plane. The electronic power module includes first gap separating the first aluminum substrate from the second aluminum substrate. The electronic power module includes a second gap separating the second aluminum substrate from the third aluminum substrate. The electronic power module includes a first semiconductor switching component electrically coupled to the first aluminum substrate and the second aluminum substrate. The electronic power module includes a second semiconductor switching component electrically coupled to the second aluminum substrate and the third aluminum substrate.
Claims6
A method of manufacturing an electronic power module, the electronic power module comprising a first substrate operable at a first potential;
- a second substrate operable at a second potential, the second substrate arranged in a common plane with the first substrate;
- a third substrate operable at a third potential, the third substrate arranged in a common plane with the first substrate and the second substrate;
- a first gap separating the first substrate from the second substrate;
- a second gap separating the second substrate from the third substrate;
- a first semiconductor switching component electrically coupled to the first substrate and the second substrate;
- and a second semiconductor switching component electrically coupled to the second substrate and the third substrate, the method comprising:
- punching the first substrate, the second substrate, and the third substrate from a sheet of metal such that the first gap separates the first substrate from the second substrate and the second gap separates the second substrate from the third substrate;
- the first substrate connected to the second substrate by one or more bridges;
- the second substrate connected to the third substrate by one or more bridges;
- screen printing one or more circuit components on the first substrate, the second substrate, and the third substrate;
- connecting the first semiconductor switching component to the first substrate and the second substrate;
- connecting the second semiconductor switching component to the second substrate and the third substrate;
- covering the first substrate, the second substrate, and the third substrate with a packaging material.
Dependencies are inferred from the claim text.