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US 11,776,937 B2Granted
Electronic module
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorKosuke Ikeda
Life of this patent
Estimating the term…
Abstract
An electronic module has a first substrate 11; a first electronic element 13 provided on one side of the first substrate 11; a first connection body 60 provided on the one side of the first electronic element 13; a second electronic element 23 provided on the one side of the first connection body 60; and a second connection body 70 provided on the one side of the second electronic element 23. The first electronic element 13 and the second electronic element 23 do not overlap in a plane direction.
Claims6
An electronic module comprising:
- a first substrate which is a ceramic substrate, an insulating resin layer or a metal substrate;
- a first electronic element provided on upper side of the first substrate;
- a first connection body provided on upper side of the first electronic element;
- a second electronic element provided on upper side of the first connection body;
- and
- a second connection body provided on upper side of the second electronic element, wherein
- the first electronic element and the second electronic element do not overlap in a plane direction,
- the first connection body has a first head part including a first head area on lower side of the first connection body where the first electronic element is provided, a second head area on upper side of the first connection body where the second electronic element is provided, and a bent part provided between the first head area and the second head area in the plane direction, and
- the first connection body has a plurality of first support parts extending from the first head part and abutting on the first substrate, or the second connection body has a second head part and a plurality of second support parts extending from the second head part and abutting on the first substrate,
- the first connection body has a plurality of first pillar parts extending from the first head part to lower side,
- the second connection body has a second head part and a second pillar part extending from the second head part to lower side, and
- the second electronic element is sandwiched between one of the first pillar parts and the second pillar part, wherein the second electronic element, the one of the first pillar parts and the second pillar part overlap in the plane direction, and
- at least another one of the first pillar parts and the second pillar part do not overlap in the plane direction.
10 more elements
An electronic module comprising:
- a first substrate which is a ceramic substrate, an insulating resin layer or a metal substrate;
- a first electronic element provided on upper side of the first substrate;
- a first connection body provided on upper side of the first electronic element;
- a second electronic element provided on upper side of the first connection body;
- and
- a second connection body provided on upper side of the second electronic element, wherein
- the first electronic element and the second electronic element do not overlap in a plane direction,
- the first connection body has a first head part including a first head area on lower side of the first connection body where the first electronic element is provided, a second head area on upper side of the first connection body where the second electronic element is provided, and a bent part provided between the first head area and the second head area in the plane direction, and
- (1) the first connection body has a plurality of first support parts extending from the first head part and abutting on the first substrate, at least one of the first support parts functions electrically and at least one of the first support parts does not function electrically, or (2) the second connection body has a second head part and a plurality of second support parts extending from the second head part and abutting on the first substrate,
- at least one of the second support parts functions electrically- and at least one of the second support parts does not function electrically.
7 more elements
An electronic module comprising:
- a first substrate which is a ceramic substrate, an insulating resin layer or a metal substrate;
- a first electronic element provided on upper side of the first substrate;
- a first connection body provided on upper side of the first electronic element;
- a second electronic element provided on upper ene side of the first connection body;
- and
- a second connection body provided on upper side of the second electronic element, wherein
- the first electronic element and the second electronic element do not overlap in a plane direction,
- the first connection body has a first head part including a first head area on lower side of the first connection body where which the first electronic element is provided, a second head area on upper side of the first connection body where the second electronic element is provided, and a bent part provided between the first head area and the second head area in the plane direction,
- the first connection body has a plurality of first pillar parts extending from the first head part to lower side, and a plurality of first support parts extending from the first head part,
- the second connection body has a second head part, a second pillar part extending from the second head part to lower side, and a plurality of second support parts extending from the second head part to lower side,
- the second electronic element, one of the first pillar parts and the second pillar part overlap in the plane direction, and at least another one of the first pillar parts and the second pillar part do not overlap in the plane direction,
- at least one of the first support parts functions electrically, and at least one of the first support parts does not function electrically, and
- at least one of the second support parts functions electrically, and at least one of the second support parts does not function electrically.
10 more elements
Dependencies are inferred from the claim text.