Die bond head apparatus with die holder motion table

A die bond head apparatus, comprising:

• a die bond head body coupled to a die bond head motion table for moving the die bond head body along at least one axis;
• a die holder motion table mounted on the die bond head body;
• a die holder which is operative in use to secure a semiconductor die to a substrate, the die holder being positionable by the die holder motion table to move the die holder along the at least one axis independently of the die bond head motion table;
• and
• an imaging device positioned over the substrate that is operative in use to image a placing location on the substrate, the imaging device being configured such that the die holder motion table is movable to a position between the imaging device and the substrate such that the die holder motion table is located between the imaging device and the die holder, whereat the imaging device is further operative to image at least a portion of the die holder and/or the semiconductor die held by the die holder to determine at least one of position and orientation information of the die holder and/or the semiconductor die after the die bond head body is located proximate the placing location along the at least one axis by the die bond head motion table, wherein the die holder motion table is further operative to adjust the position and orientation of the die holder and/or the semiconductor die relative to the placing location,
• wherein the die holder motion table comprises at least one aperture through which at least one inspection light path passes through the die holder motion table for allowing the imaging device to image at least a portion of the die holder and/or the semiconductor die held by the die holder.