Compressible foamed thermal interface materials and methods of making the same
AssigneeLaird Technologies, Inc.
InventorsVijayaraghavan Rajagopal, Eugene Anthony Pruss, Richard F. Hill
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Abstract
Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.
Claims26
A compressible foamed thermal interface material comprising a matrix, at least one thermally-conductive filler within the matrix, and a plurality of pores, wherein the compressible foamed thermal interface material has a sufficiently closed porosity such that the matrix is connected relatively well thereby enabling the compressible foamed thermal interface material to maintain a thermal conductivity of at least about 1.5 Watts per meter Kelvin, whereby the compressible foamed thermal interface material is compressible and deflectable upon application of pressure and rebounds upon removal of the pressure.
Dependencies are inferred from the claim text.