Semiconductor package

A semiconductor package, comprising:

• a multilayer substrate having a first surface and a second surface opposite to the first surface, wherein the multilayer substrate comprises through holes, and each of the through holes extends from the first surface to the second surface;
• a shielding structure, comprising:
• a cover body;
• a plurality of compartments concaved from a bottom surface of the cover body facing the multilayer substrate toward a top surface of the cover body facing away from the multilayer substrate to be disposed inside of the cover body and separated by compartment walls of the shielding structure;
• and
• a plurality of conductive pillars peripherally surrounding each of the plurality of compartments, wherein the plurality of conductive pillars is provided within the through holes of the multilayer substrate and extended from the first surface to the second surface;
• and
• a plurality of device dies respectively accommodated within the plurality of compartments.

A semiconductor package, comprising:

• a multilayer substrate having a first surface and a second surface opposite to the first surface, wherein the multilayer substrate comprises through holes, and each of the through holes extends from the first surface to the second surface;
• a plurality of device dies laterally disposed on the multilayer substrate and electrically connected with the multilayer substrate, wherein at least one of the through holes is disposed close to a center of the multilayer substrate and disposed between two of the plurality of device dies;
• a circuit board disposed below the multilayer substrate and electrically connected with the multilayer structure;
• and
• a shielding structure disposed on the multilayer substrate and covering the plurality of device dies, wherein void spaces are existed between sidewalls of the shielding structure and the plurality of device dies and surrounding the plurality of device dies;
• wherein the shielding structure comprises conductive pillars, and the conductive pillars are fitted into the through holes of the multilayer substrate and protruded out from the second surface of the multilayer substrate, the conductive pillars are connected to the circuit board to electrically connect the shielding structure with the circuit board.