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US 11,776,917 B2Granted
Electronic package
AssigneeAdvanced Semiconductor Engineering Korea, Inc.
InventorsSeokbong Kim, Eunshim Lee
Life of this patent
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Abstract
The present disclosure provides an electronic package and method of manufacturing the same. The electronic package includes an electronic device including a first carrier and a first electronic component disposed on the first carrier, a second carrier adjacent to the first carrier of the electronic device, and a conductive layer at least partially covering the electronic device, and separating the electronic device from the second carrier.
Claims5
An electronic package, comprising:
- a substrate;
- an electronic device disposed over the substrate, wherein the electronic device comprises a first carrier and a first electronic component disposed over the first carrier;
- a second electronic component disposed over the substrate;
- a second carrier separated from the first carrier by a gap, wherein an electrical element passes through the gap to electrically connect the second electronic component to the substrate;
- and
- a conductive lid passing through the gap and separating the electronic device from the second carrier.
3 more elements
Dependencies are inferred from the claim text.