FPGA device forming network-on-chip by using silicon connection layer

An FPGA device forming a network-on-chip by using a silicon connection layer, wherein the FPGA device comprises a substrate, a silicon connection layer laminated on the substrate, and an FPGA bare die laminated on the silicon connection layer;

• the FPGA bare die comprises at least a plurality of bare die functional modules, a bare die silicon stack connection module and a bare die connection point leading-out terminal;
• the bare die silicon stack connection module comprises a plurality of bare die silicon stack connection points, each of the bare die functional modules is connected to the bare die silicon stack connection points respectively, and the bare die silicon stack connection points are connected to the corresponding bare die connection point leading-out terminal through a metal wire in a re-distribution layer;
• a silicon connection layer interconnection framework is arranged within the silicon connection layer, the silicon connection layer interconnection framework comprises routers, network interfaces and routing channels, adjacent routers are connected through the routing channels respectively, and each of the routers is connected to one network interfaces;
• and
• the bare die connection point leading-out terminals on the FPGA bare die that are connected to the bare die functional modules are connected to the network interfaces in the silicon connection layer, so that the corresponding bare die functional modules are connected to the silicon connection layer interconnection framework to form a network-on-chip, each of the bare die functional modules is connected to one network interface in the silicon connection layer interconnection framework,
• wherein the FPGA device comprises a plurality of first NOC nodes for the network-on-chip, each NOC node comprises one of the bare die functional modules and the network interface and router connected to one of the bare die functional modules, the first NOC nodes are interconnected through the routing channels, and the plurality of the bare die functional modules in the FPGA bare die intercommunicate with one another through the network-on-chip.