Package device
AssigneeInnolux Corporation
InventorsYeong-E Chen, Cheng-En Cheng, Yu-Ting Liu
Life of this patent
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Abstract
A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a second dielectric layer, and a conductive layer. The second dielectric layer is disposed on the first dielectric layer, and the second dielectric layer includes a dielectric pattern. The conductive layer is disposed between the first dielectric layer and the second dielectric layer, and the conductive layer includes a first conductive pattern. The dielectric pattern has a through hole, and in a top view of the package device, the first conductive pattern and the through hole are overlapped with each other.
Claims9
A package device, comprising:
- a redistribution layer comprising:
- a first dielectric layer;
- a second dielectric layer disposed on the first dielectric layer, wherein the second dielectric layer comprises a dielectric pattern;
- and
- a conductive layer disposed between the first dielectric layer and the second dielectric layer, wherein the conductive layer comprises a first conductive pattern;
- wherein the dielectric pattern has a through hole, and wherein in a top view of the package device, the first conductive pattern and the through hole are overlapped with each other, and a shape of the first conductive pattern is corresponding to a shape of the through hole in the top view of the package device.
Dependencies are inferred from the claim text.