Electronic module, manufacturing method thereof and electronic package having the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsHo-Chuan Lin, Chia-Chu Lai, Min-Han Chuang
Life of this patent
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Abstract
An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.
Claims16
An electronic module, comprising:
- an electronic component having an active face and a non-active face opposite to the active face and side faces adjacent to the active face and the non-active face, and the active face including a plurality of electrode pads;
- and
- a capacitor structure formed on the non-active face and/or the side faces of the electronic component and free from being formed on the active face, wherein the capacitor structure includes a first metal layer disposed on and in contact with the electronic component and electrically connected with the plurality of electrode pads, an insulating layer disposed on the first metal layer, and a second metal layer disposed on the insulating layer and coupled with the first metal layer, and wherein the first metal layer is free from being in contact with the second metal layer.
Dependencies are inferred from the claim text.